The global hermetic packaging market size was estimated at USD 4.01 billion in 2024 and is projected to reach USD 5.90 billion by 2030, growing at a CAGR of 6.9% from 2025 to 2030. Hermetic packaging plays a vital role in safeguarding electronic systems by creating an airtight seal that prevents external environmental elements from entering the package. This protective barrier shields sensitive electronic components from harmful conditions such as moisture, humidity, temperature fluctuations, contamination, and variations in atmospheric pressure, all of which can negatively affect electrical connections and device performance. By ensuring long-term stability and reliability, hermetic packaging is widely adopted in applications where consistent performance and durability are essential.

Hermetic packaging has witnessed increasing demand in the automotive industry owing to its capability to protect critical electronic components from environmental hazards such as dust, moisture, corrosive gases, and vibration. Modern vehicles rely heavily on advanced electronics, making reliable packaging solutions crucial for maintaining operational safety and efficiency. Automotive manufacturers require high-quality sealing technologies that enhance product lifespan while minimizing the risk of component failure. Key automotive components that commonly utilize hermetic packaging include sensors, microprocessors, control units, and power modules. These elements are essential for vehicle safety systems, engine management, and electronic control mechanisms, and any malfunction may result in performance issues or serious safety risks.

The growing adoption of electric vehicles has further accelerated the demand for hermetic packaging solutions within the automotive sector. According to the EV volumes report, annual sales of EVs reached a new high of 10.2 million units globally in 2022, representing a 55% increase compared to the previous year. Electric vehicles incorporate a significantly higher number of electronic and semiconductor components than conventional vehicles, including battery management systems, power electronics, and advanced sensing technologies. These sensitive systems require effective hermetic sealing to protect against moisture ingress, thermal stress, and environmental exposure, ensuring reliable operation, improved safety, and extended component life in increasingly electrified transportation systems.

Key Market Trends & Insights:

Asia Pacific accounted for the largest revenue share of over 45.0% in 2024, establishing itself as the leading regional contributor to the overall hermetic packaging industry. The region’s dominance can be attributed to rapid industrialization, expanding electronics manufacturing capabilities, and strong growth across automotive, telecommunications, and semiconductor industries. Countries within Asia Pacific continue to witness rising investments in advanced manufacturing infrastructure and technological innovation, which has significantly increased the demand for reliable packaging solutions that ensure component durability and performance. Additionally, the presence of major electronics producers and growing adoption of electric vehicles and consumer electronics further support the region’s strong market position.

India is expected to register the highest CAGR from 2025 to 2030, driven by increasing government initiatives supporting domestic manufacturing, infrastructure expansion, and advancements in electronics and defense production. The country’s growing focus on semiconductor development, aerospace innovation, and defense modernization is encouraging the adoption of advanced hermetic packaging technologies. Rising investments in research and development, along with the expansion of local manufacturing ecosystems, are creating favorable conditions for sustained industry growth in India during the forecast period.

By product, the ceramic-to-metal sealing segment emerged as the largest product category in the market, accounting for a revenue share of over 56.0% in 2024. This segment’s leadership is primarily due to its superior sealing performance, high mechanical strength, and excellent resistance to extreme temperatures and harsh environmental conditions. Ceramic-to-metal seals are widely used in applications that require long-term reliability and airtight protection, particularly in electronics, aerospace systems, medical devices, and high-performance industrial equipment. Their ability to maintain structural integrity under demanding operational environments makes them a preferred choice across multiple high-reliability applications.

By application, the military and defense segment dominated the market with a revenue share of over 32.0% in 2024. The strong demand from this segment is largely driven by the need for highly reliable and durable electronic systems used in defense equipment, communication systems, radar technologies, and aerospace applications. Military-grade components must operate effectively in extreme environmental conditions, including high pressure, temperature variations, and exposure to moisture or contaminants. Hermetic packaging ensures operational stability, enhanced safety, and long service life, making it an essential solution for critical defense and security applications worldwide.

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Market Size & Forecast:

• 2024 Market Size: USD 4.01 Billion

• 2030 Projected Market Size: USD 5.90 Billion

• CAGR (2025-2030): 6.9%

• Asia Pacific: Largest market in 2024

Key Companies & Market Share Insights:

The market is characterized by the strong presence of well-established players that actively compete through innovation, operational expansion, and strategic collaborations. To strengthen their competitive positioning and expand their market footprint, key product manufacturers are increasingly adopting aggressive growth strategies such as new product launches, production capacity expansion, mergers and acquisitions, and long-term supply agreements. These initiatives enable companies to enhance technological capabilities, improve supply chain efficiency, and address the rising demand for high-performance hermetic packaging solutions across industries such as electronics, automotive, aerospace, and healthcare. Continuous investment in research and development also allows market participants to introduce advanced materials and packaging technologies that improve durability, reliability, and environmental resistance.

In October 2024, CPS Technologies Corporation secured a USD 12 million contract with a longstanding multinational semiconductor manufacturer to supply power module components over the next year. This agreement represents a 50% increase in orders compared to the previous year, highlighting the growing industry reliance on CPS’s aluminum silicon carbide products. These materials are increasingly preferred due to their superior thermal management and mechanical strength, which are essential for high-performance applications. The contract reflects expanding demand from sectors such as high-speed rail, wind energy systems, and electric and hybrid vehicles, where efficient heat dissipation and component reliability are critical for operational safety and long-term performance.

In March 2023, Schott AG initiated the production of amber pharmaceutical glass in India to address the rising regional demand for specialized glass materials. This development is expected to significantly improve the availability of borosilicate glass for manufacturers operating within the hermetic packaging industry in India. By localizing production, the company aims to reduce supply chain constraints, shorten delivery timelines, and support the growing needs of pharmaceutical, electronics, and high-precision packaging applications. The expansion also reflects increasing industrial activity in the region and the rising importance of high-quality sealing materials required for protecting sensitive components from environmental exposure.

Key Players

• NGK Spark Plug Co., Ltd.

• Schott AG

• AMETEK, Inc.

• Amkor Technology

• Texas Instruments Incorporated

• Teledyne Microelectronic Technology

• Kyocera Corporation

• Materion Corporation

• Egide S.A.

• Micross Components, Inc.

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Conclusion:

The hermetic packaging industry is witnessing steady growth driven by the rising need to protect sensitive electronic components from environmental factors such as moisture, pressure variations, and contamination. Increasing adoption across high-reliability sectors—including automotive electronics, aerospace and defense, telecommunications, and industrial applications—is strengthening long-term demand for hermetically sealed solutions. The growing complexity of electronic systems and the expansion of advanced technologies are further reinforcing the importance of durable and high-performance packaging.